The Wafer Aligner HPA reliably aligns transparent, translucent and opaque wafers. Whether the standard, warpage or edge contact process is used, the new models align wafers with a diameter of 2 inches up to 12 inches in just a few seconds. Three moving HIWIN axes with spindle drive are used here for wafer centring and angular alignment. Depending on the aligner model, an X-Y unit or an X-Z unit is used. Due to its compact design, the HPA series is also ideal for integration into demanding system concepts. Ideal for applications in the semiconductor industry, the Wafer Aligner of the HPA series is suitable for clean room class ISO 3.